1. 2. 3. material content data sheet sales product name 2ed020i12-f2 issued 29. august 2013 ma# MA001021436 package pg-dso-36-58 weight* 629.29 mg construction element material group substances cas# if applicable weight [mg] average mass [%] sum [%] average mass [ppm] sum [ppm] chip inorganic material silicon 7440-21-3 4.549 0.72 0.72 7228 7228 leadframe inorganic material phosphorus 7723-14-0 0.055 0.01 88 non noble metal zinc 7440-66-6 0.220 0.04 350 non noble metal iron 7439-89-6 4.406 0.70 7002 non noble metal copper 7440-50-8 178.916 28.43 29.18 284315 291755 wire noble metal gold 7440-57-5 1.255 0.20 0.20 1994 1994 encapsulation organic material carbon black 1333-86-4 0.865 0.14 1374 plastics epoxy resin - 39.784 6.32 63221 inorganic material silicondioxide 60676-86-0 391.790 62.27 68.73 622592 687187 leadfinish non noble metal tin 7440-31-5 4.296 0.68 0.68 6827 6827 plating noble metal silver 7440-22-4 1.022 0.16 0.16 1624 1624 glue plastics epoxy resin - 0.533 0.08 846 noble metal silver 7440-22-4 1.598 0.25 0.33 2539 3385 *deviation < 10% sum in total: 100,00 1000000 important remarks: infineon technologies ag provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. infineon technologies ag and infineon technologies ag suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. all statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. company infineon technologies ag address 81726 mnchen internet www.infineon.com
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